Invention Grant
- Patent Title: Electronic device including an externally-mounted heat pipe
- Patent Title (中): 电子设备包括外置热管
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Application No.: US14678438Application Date: 2015-04-03
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Publication No.: US09468086B1Publication Date: 2016-10-11
- Inventor: Avraham Yeini , Jody Akens , Peter Gilmore , George Mtchedlishvili
- Applicant: MOTOROLA SOLUTIONS, INC.
- Applicant Address: US IL Chicago
- Assignee: Motorola Soultions, Inc.
- Current Assignee: Motorola Soultions, Inc.
- Current Assignee Address: US IL Chicago
- Agency: Michael Best & Friedrich LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K9/00 ; H01L23/427 ; H05K1/02 ; H05K1/18 ; H05K5/06
Abstract:
An electronic device including a housing having a container and a cover. The cover has an opening. The electronic device also includes a circuit board positioned within the container. The circuit board includes an electrical component that is aligned with the opening. The electronic device further includes a heat pipe mounted to the cover. A portion of the heat pipe extends into the opening of the cover to thermally communicate with the electrical component.
Public/Granted literature
- US20160295679A1 ELECTRONIC DEVICE INCLUDING AN EXTERNALLY-MOUNTED HEAT PIPE Public/Granted day:2016-10-06
Information query
