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发明授权
US09469571B2 Handle substrates of composite substrates for semiconductors 有权
处理半导体复合基板的基板

Handle substrates of composite substrates for semiconductors
摘要：
A handle substrate 1 is made of a translucent ceramics. An average density of pores having a size of 0.5 to 3.0 μm included in a surface region 2A on the side of a bonding face 1a of the handle substrate 1 is 50 counts/mm2 or smaller. It is formed a region 3, whose average density of pores having a size of 0.5 to 3.0 μm is 100 counts/mm2 or larger, in the handle substrate 1. The translucent ceramics has an average grain size of 5 to 60 μm.
摘要（中）：

手柄基板1由半透明陶瓷制成。 手柄基板1的接合面1a侧的表面区域2A中包含的尺寸为0.5〜3.0μm的孔的平均密度为50个/ mm 2以下。 在手柄基板1中形成有尺寸为0.5〜3.0μm的孔的平均密度为100个/ mm 2以上的区域3。透光性陶瓷的平均粒径为5〜60μm。

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