Invention Grant
- Patent Title: Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module
- Patent Title (中): 固体电解电容器,电子部件模块,固体电解电容器的制造方法及电子部件模块的制造方法
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Application No.: US14591068Application Date: 2015-01-07
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Publication No.: US09472351B2Publication Date: 2016-10-18
- Inventor: Akio Katsube , Hiroki Kitayama , Shinji Otani , Koji Murata
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2014-002420 20140109
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G9/15 ; H01G9/012 ; H01G9/00 ; H05K3/34 ; H01G9/14 ; H01G9/042 ; H05K1/18

Abstract:
A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
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