Invention Grant
US09472425B2 Power distribution improvement using pseudo-ESR control of an embedded passive capacitor
有权
使用嵌入式无源电容器的伪ESR控制进行功率分配改进
- Patent Title: Power distribution improvement using pseudo-ESR control of an embedded passive capacitor
- Patent Title (中): 使用嵌入式无源电容器的伪ESR控制进行功率分配改进
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Application No.: US14663342Application Date: 2015-03-19
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Publication No.: US09472425B2Publication Date: 2016-10-18
- Inventor: Young Kyu Song , Kyu-Pyung Hwang , Jae Sik Lee
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Seyfarth Shaw LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L49/02
Abstract:
A fan-out wafer level package structure may include a multilayer redistribution layer (RDL). The multilayer RDL may be configured to couple with terminals of an embedded capacitor. The multilayer RDL may include sections with fewer layers than other sections of the multilayer RDL according to a selected equivalent series resistance (ESR) control pattern.
Public/Granted literature
- US20160276173A1 POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBEDDED PASSIVE CAPACITOR Public/Granted day:2016-09-22
Information query
IPC分类:
