Invention Grant
US09472533B2 Semiconductor device and method of forming wire bondable fan-out EWLB package
有权
形成可焊接扇出EWLB封装的半导体器件和方法
- Patent Title: Semiconductor device and method of forming wire bondable fan-out EWLB package
- Patent Title (中): 形成可焊接扇出EWLB封装的半导体器件和方法
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Application No.: US14548064Application Date: 2014-11-19
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Publication No.: US09472533B2Publication Date: 2016-10-18
- Inventor: Rajendra D. Pendse
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/065 ; H01L23/31 ; H01L23/00

Abstract:
A semiconductor device has a first semiconductor die and a first encapsulant deposited over the first semiconductor die. An interconnect structure is formed over the first semiconductor die and first encapsulant. A modular interconnect structure including a conductive via is disposed adjacent to the first semiconductor die. The first encapsulant is deposited over the modular interconnect structure. An opening is formed in the first encapsulant extending to the modular interconnect structure or to the interconnect structure. A second semiconductor die is disposed over the first semiconductor die. A bond wire is formed over the second semiconductor die and extends into the opening in the first encapsulant. A cap is formed over an active region of the second semiconductor die. A second encapsulant is deposited over the second semiconductor die and bond wire. Alternatively, a lid is formed over the second semiconductor die and bond wire.
Public/Granted literature
- US20150140736A1 Semiconductor Device and Method of Forming Wire Bondable Fan-Out EWLB Package Public/Granted day:2015-05-21
Information query
IPC分类: