Invention Grant
- Patent Title: Semiconductor package structure and method for manufacturing the same
- Patent Title (中): 半导体封装结构及其制造方法
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Application No.: US14479526Application Date: 2014-09-08
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Publication No.: US09478499B2Publication Date: 2016-10-25
- Inventor: Chien-Li Kuo
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Priority: CN201410341647 20140717
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/48 ; H01L23/04 ; H01L23/538 ; H01L21/56 ; H01L21/78 ; H01L25/065 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure has a substrate and a die stack of n die(s), wherein n≧1. The substrate has a first side, a second side and an opening extending from the first side to the second side. The die stack is disposed in the opening. The thickness of the substrate is substantially the same as the thickness of the die stack.
Public/Granted literature
- US20160020175A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-01-21
Information query
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