发明授权
US09478682B2 IR sensor package including a cover member and a sensor chip recessed into the package body
有权
红外传感器封装包括一个盖构件和一个嵌入封装体内的传感器芯片
- 专利标题： IR sensor package including a cover member and a sensor chip recessed into the package body
- 专利标题（中）： 红外传感器封装包括一个盖构件和一个嵌入封装体内的传感器芯片
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申请号： US13806111申请日： 2011-06-23
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公开(公告)号： US09478682B2公开(公告)日： 2016-10-25
- 发明人: Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
- 申请人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
- 申请人地址： JP Osaka
- 专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2010-144176 20100624
- 国际申请： PCT/JP2011/064435 WO 20110623
- 国际公布： WO2011/162346 WO 20111229
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232 ; H01L31/024 ; G01J5/04 ; G01J5/06 ; G01J5/08 ; G01J5/12
摘要：
The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
公开/授权文献
- US20130093037A1 INFARED SENSOR 公开/授权日：2013-04-18
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