Invention Grant
- Patent Title: Resonator device including electrode with buried temperature compensating layer
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Application No.: US12769791Application Date: 2010-04-29
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Publication No.: US09479139B2Publication Date: 2016-10-25
- Inventor: Richard C. Ruby , Wei Pang , Qiang Zou , Donald Lee
- Applicant: Richard C. Ruby , Wei Pang , Qiang Zou , Donald Lee
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L41/08
- IPC: H01L41/08 ; H03H9/13 ; H03H3/04 ; H03H9/02 ; H03H9/17

Abstract:
An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.
Public/Granted literature
- US20110266925A1 RESONATOR DEVICE INCLUDING ELECTRODE WITH BURIED TEMPERATURE COMPENSATING LAYER Public/Granted day:2011-11-03
Information query
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