Invention Grant
US09482947B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device and electronic device
有权
图案形成方法，光化射线敏感或辐射敏感树脂组合物，抗蚀剂膜，电子器件和电子器件的制造方法
- Patent Title: Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device and electronic device
- Patent Title (中): 图案形成方法，光化射线敏感或辐射敏感树脂组合物，抗蚀剂膜，电子器件和电子器件的制造方法
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Application No.: US14035139Application Date: 2013-09-24
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Publication No.: US09482947B2Publication Date: 2016-11-01
- Inventor: Shuhei Yamaguchi , Hidenori Takahashi , Michihiro Shirakawa , Shohei Kataoka , Shoichi Saitoh , Fumihiro Yoshino
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-075855 20110330
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/32 ; G03F7/038 ; C08F20/28 ; C08F220/28 ; G03F7/004 ; G03F7/11 ; G03F7/20 ; G03F7/40
Abstract:
A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit capable of decomposing by an action of an acid to produce a carboxyl group, represented by the following formula (I) as defined in the specification and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film; and (iii) a step of performing a development by using a developer containing an organic solvent to form a negative pattern.
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Information query
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