Invention Grant
- Patent Title: Simultaneous independently controlled dual side PCB molding technique
- Patent Title (中): 同时独立控制双面PCB成型技术
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Application No.: US14563798Application Date: 2014-12-08
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Publication No.: US09484228B2Publication Date: 2016-11-01
- Inventor: Scott L. Gooch , Shankar S. Pennathur
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: B29C45/14
- IPC: B29C45/14 ; H01L21/56 ; B29C45/27 ; B29C45/76 ; B29C45/02 ; H05K3/00 ; B29L31/34 ; H05K3/28
Abstract:
Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity.
Public/Granted literature
- US20160099159A1 SIMULTANEOUS INDEPENDENTLY CONTROLLED DUAL SIDE PCB MOLDING TECHNIQUE Public/Granted day:2016-04-07
Information query
