Invention Grant
- Patent Title: Chip structure having bonding wire
- Patent Title (中): 具有接合线的芯片结构
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Application No.: US14668994Application Date: 2015-03-26
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Publication No.: US09484315B2Publication Date: 2016-11-01
- Inventor: Yu-Min Lin , Po-Chen Lin , Jing-Yao Chang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW103142590A 20141208
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00

Abstract:
A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.
Public/Granted literature
- US20160163665A1 CHIP STRUCTURE HAVING BONDING WIRE Public/Granted day:2016-06-09
Information query
IPC分类: