Invention Grant
US09484323B2 Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
有权
制造半导体封装的方法和用于执行该半导体封装的引线接合装置
- Patent Title: Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
- Patent Title (中): 制造半导体封装的方法和用于执行该半导体封装的引线接合装置
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Application No.: US14718438Application Date: 2015-05-21
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Publication No.: US09484323B2Publication Date: 2016-11-01
- Inventor: Seok-Won Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0107280 20140818
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L21/66 ; H01L25/00 ; H01L25/065 ; B23K20/00
Abstract:
In a method of manufacturing a semiconductor package, a first semiconductor chip is adhered to a package substrate. An end portion of a wire is bonded to a first bonding pad of the first semiconductor chip by using a capillary. An operating voltage of the first semiconductor chip is applied to the first bonding pad through the wire to detect a leakage current. A second end portion of the wire is bonded to the first connection pad by using the capillary, according to a result of the detection.
Public/Granted literature
- US20160049382A1 METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND WIRE BONDING APPARATUS FOR PERFORMING THE SAME Public/Granted day:2016-02-18
Information query
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