Invention Grant
- Patent Title: Array substrate, manufacturing method thereof and display device
- Patent Title (中): 阵列基板及其制造方法以及显示装置
-
Application No.: US14374987Application Date: 2013-12-09
-
Publication No.: US09484465B2Publication Date: 2016-11-01
- Inventor: Hyun Sic Choi , Hui Li , Zhiqiang Xu , Yoon Sung Um
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201310210510 20130530
- International Application: PCT/CN2013/088829 WO 20131209
- International Announcement: WO2014/190713 WO 20141204
- Main IPC: G02F1/1343
- IPC: G02F1/1343 ; H01L29/786 ; H01L27/12 ; H01L29/417 ; G02F1/1368 ; G02F1/1362

Abstract:
A array substrate is disclosed. The array substrate includes: a substrate (10); and a first gate metal layer (111), a first gate insulating layer (121), a semiconductor layer (13) and a source-drain electrode layer (14) disposed in this order on the substrate from bottom to top. The array substrate (10) further includes a second gate insulating layer (122) disposed on the source-drain electrode layer (14); and a second gate metal layer (112) disposed on the second gate insulating layer (122). A method of manufacturing an array substrate is also disclosed.
Public/Granted literature
- US20150325705A1 ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE Public/Granted day:2015-11-12
Information query
IPC分类: