Invention Grant
- Patent Title: Light emitting device and method for manufacturing same
- Patent Title (中): 发光装置及其制造方法
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Application No.: US14274872Application Date: 2014-05-12
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Publication No.: US09484511B2Publication Date: 2016-11-01
- Inventor: Ryoma Suenaga , Hiroto Tamaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2013-101219 20130513
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00 ; H01L33/36 ; H01L23/00 ; H01L33/48

Abstract:
A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
Public/Granted literature
- US20150325760A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-11-12
Information query
IPC分类: