Invention Grant
US09485864B2 Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
有权
凸块结构，布线基板，半导体装置和凸块结构的制造方法
- Patent Title: Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
- Patent Title (中): 凸块结构，布线基板，半导体装置和凸块结构的制造方法
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Application No.: US14328765Application Date: 2014-07-11
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Publication No.: US09485864B2Publication Date: 2016-11-01
- Inventor: Kei Imafuji , Katsumi Yamazaki , Noritaka Katagiri , Teruaki Chino
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2013-155615 20130726
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K3/34 ; H05K3/40
Abstract:
A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.
Public/Granted literature
- US20150029689A1 BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP STRUCTURE MANUFACTURING METHOD Public/Granted day:2015-01-29
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