Invention Grant
- Patent Title: Separation of chips on a substrate
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Application No.: US14977625Application Date: 2015-12-21
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Publication No.: US09490103B2Publication Date: 2016-11-08
- Inventor: Manfred Engelhardt , Gudrun Stranzl , Markus Zundel , Hubert Maier
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01J37/32 ; B28D5/00
Abstract:
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts.
Public/Granted literature
- US20160111255A1 Separation of Chips on a Substrate Public/Granted day:2016-04-21
Information query
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