Invention Grant
- Patent Title: Stud bump structure and method for manufacturing the same
- Patent Title (中): 螺柱凸块结构及其制造方法
-
Application No.: US13762132Application Date: 2013-02-07
-
Publication No.: US09490147B2Publication Date: 2016-11-08
- Inventor: Tung-Han Chuang , Hsing-Hua Tsai , Jun-Der Lee
- Applicant: Wire Technology Co., LTD.
- Applicant Address: TW Taichung
- Assignee: Wire Technology Co., Ltd.
- Current Assignee: Wire Technology Co., Ltd.
- Current Assignee Address: TW Taichung
- Priority: TW101141253A 20121107
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/48 ; H01L23/498 ; H01L23/00
Abstract:
A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.
Public/Granted literature
- US20140124920A1 STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-05-08
Information query
IPC分类:
