公开(公告)号：US09425168B2

公开(公告)日：2016-08-23

申请号：US14256233

申请日：2014-04-18

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han Chuang ,  Hsing-Hua Tsai ,  Jun-Der Lee

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/73204 ,  H01L2224/8109 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8181 ,  H01L2224/8381 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/07802 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/11462 ,  H01L2224/13144 ,  H01L2924/1204

Abstract: A stud bump structure, a package structure thereof and method of manufacturing the package structure are provided. The stud bump structure include a first chip; and a silver alloy stud bump disposed on the substrate, wherein the on-chip silver alloy stud bump includes Pd of 0.01˜10 wt %, while the balance is Ag. The package structure further includes a substrate having an on-substrate bond pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.

Abstract translation: 提供了一种螺柱凸块结构，其封装结构和制造封装结构的方法。 螺柱凸块结构包括第一芯片; 和设置在基板上的银合金凸块凸块，其中片上银合金凸块凸块包括0.01〜10重量％的Pd，余量为Ag。 封装结构还包括具有通过倒装芯片接合电连接到片上银合金柱形凸块的衬底上焊盘的衬底。

公开(公告)号：US09490147B2

公开(公告)日：2016-11-08

申请号：US13762132

申请日：2013-02-07

Applicant: Wire Technology Co., LTD.

Inventor： Tung-Han Chuang ,  Hsing-Hua Tsai ,  Jun-Der Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Abstract translation: 提供了一种螺柱凸块结构及其制造方法。 所述柱状凸块结构包括基板和设置在所述基板上的第一银合金凸块凸块，其中所述第一银合金凸块具有Ag：Au：Pd = 60-99.98：0.01-30：0.01-10的重量百分比 。

公开(公告)号：US20150194409A1

公开(公告)日：2015-07-09

申请号：US14256233

申请日：2014-04-18

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han Chuang ,  Hsing-Hua Tsai ,  Jun-Der Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/73204 ,  H01L2224/8109 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8181 ,  H01L2224/8381 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/07802 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/11462 ,  H01L2224/13144 ,  H01L2924/1204

Abstract: A stud bump structure, a package structure thereof and method of manufacturing the package structure are provided. The stud bump structure include a first chip; and a silver alloy stud bump disposed on the substrate, wherein the on-chip silver alloy stud bump includes Pd of 0.01˜10 wt %, while the balance is Ag. The package structure further includes a substrate having an on-substrate bond pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.

Abstract translation: 提供了一种螺柱凸块结构，其封装结构和制造封装结构的方法。 螺柱凸块结构包括第一芯片; 和设置在基板上的银合金凸块凸块，其中片上银合金凸块凸块包括0.01〜10重量％的Pd，余量为Ag。 封装结构还包括具有通过倒装芯片接合电连接到片上银合金柱形凸块的衬底上焊盘的衬底。