Invention Grant
- Patent Title: Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal
- Patent Title (中): 集成装置包括提供用于接地信号的电路的散热层
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Application No.: US14462265Application Date: 2014-08-18
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Publication No.: US09490226B2Publication Date: 2016-11-08
- Inventor: Young Kyu Song , Hong Bok We , Dong Wook Kim , Kyu-Pyung Hwang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00 ; H01L23/34 ; H01L23/373 ; H01L23/498 ; H01L21/48 ; H05K1/02

Abstract:
Provided herein is an integrated device that includes a substrate, a die, a heat-dissipation layer located between the substrate and the die, and a first interconnect configured to couple the die to the heat-dissipation layer. The heat-dissipation layer may be configured to provide an electrical path for a ground signal. The first interconnect may be further configured to conduct heat from the die to the heat-dissipation layer. The integrated device may also include a second interconnect configured to couple the die to the substrate. The second interconnect may be further configured to conduct a power signal between the die and the substrate. The integrated device may also include a dielectric layer located between the heat-dissipation layer and the substrate, and a solder-resist layer located between the die and the heat-dissipation layer.
Public/Granted literature
- US20160049378A1 INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN ELECTRICAL PATH FOR A GROUND SIGNAL Public/Granted day:2016-02-18
Information query
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