Invention Grant
- Patent Title: Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same
- Patent Title (中): 各向异性导电膜包括导电粘合剂层和与其相连的半导体器件
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Application No.: US14229003Application Date: 2014-03-28
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Publication No.: US09490228B2Publication Date: 2016-11-08
- Inventor: Kyoung Soo Park , Soon Young Kwon , Ji Yeon Kim , Young Woo Park , Jae Sun Han , Ja Young Hwang
- Applicant: Kyoung Soo Park , Soon Young Kwon , Ji Yeon Kim , Young Woo Park , Jae Sun Han , Ja Young Hwang
- Applicant Address: KR Gumi-Si, Kyeongsangbuk-Do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-Si, Kyeongsangbuk-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0034163 20130329
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C09J9/02 ; C09J7/00 ; C09J11/00 ; H05K3/32 ; C08K7/16 ; C08K9/02
Abstract:
An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).
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