Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
-
Application No.: US14864895Application Date: 2015-09-25
-
Publication No.: US09491858B2Publication Date: 2016-11-08
- Inventor: Yasushi Endo , Nobuyuki Tada , Kenji Naoi , Tomohito Asai , Hideo Ikeda , Michihiro Shibata
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Priority: JP2013-072959 20130329
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; C09J133/26 ; C08F220/18 ; C09J133/08 ; C09J133/10 ; H05K1/02 ; H05K3/28 ; G06F3/044 ; H05K3/46

Abstract:
This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.
Public/Granted literature
- US20160014894A1 CIRCUIT BOARD Public/Granted day:2016-01-14
Information query