Invention Grant
- Patent Title: Laser processing machine
- Patent Title (中): 激光加工机
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Application No.: US13814227Application Date: 2012-07-26
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Publication No.: US09492889B2Publication Date: 2016-11-15
- Inventor: Masami Suzuki , Norio Nishi , Junichi Matsumoto , Nobutaka Yoneyama , Satoshi Tokuoka , Etsushi Kato
- Applicant: Masami Suzuki , Norio Nishi , Junichi Matsumoto , Nobutaka Yoneyama , Satoshi Tokuoka , Etsushi Kato
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KATAOKA CORPORATION
- Current Assignee: KATAOKA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-232180 20111021
- International Application: PCT/JP2012/068979 WO 20120726
- International Announcement: WO2013/057998 WO 20130425
- Main IPC: B23K26/02
- IPC: B23K26/02 ; B23K26/04 ; B23K26/067 ; B23K26/03 ; B23K26/06 ; B23K26/08

Abstract:
A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.
Public/Granted literature
- US20130186871A1 LASER PROCESSING MACHINE Public/Granted day:2013-07-25
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