公开(公告)号：US09520905B2

公开(公告)日：2016-12-13

申请号：US14425938

申请日：2012-09-04

Applicant: Masami Suzuki

Inventor： Masami Suzuki

IPC: H03C1/52 ,  H04B1/04 ,  H04B5/00

CPC classification number: H04B1/0458 ,  H02J17/00 ,  H02J50/12 ,  H03H7/40 ,  H04B5/0037 ,  H04B5/0081

Abstract: A impedance matching apparatus (100) is provided with: a matching circuit (110) having a plurality of variable reactance elements; an incident signal/reflected signal extracting circuit (120) configured to extract an incident signal and a reflected signal; an estimating device (130) configured to estimate input impedance of a transmitting antenna (11) on the basis of the extracted incident signal and the extracted reflected signal; and a setting device (140) configured to set a value associated with one part of the plurality of variable reactance elements such that output impedance of a power supply (14) theoretically matches the input impedance on the basis of the estimated input impedance, and then adjust a value associated with at least one of the plurality of variable reactance elements according to the extracted reflected signal.

Abstract translation: 阻抗匹配装置（100）具有：具有多个可变电抗元件的匹配电路（110） 被配置为提取入射信号和反射信号的入射信号/反射信号提取电路（120） 估计装置（130），被配置为基于所提取的入射信号和所提取的反射信号来估计发射天线（11）的输入阻抗; 以及设置装置（140），其被配置为设置与所述多个可变电抗元件的一部分相关联的值，使得电源（14）的输出阻抗在理论上基于所估计的输入阻抗与所述输入阻抗匹配，然后 根据所提取的反射信号来调整与多个可变电抗元件中的至少一个相关联的值。

公开(公告)号：US09492889B2

公开(公告)日：2016-11-15

申请号：US13814227

申请日：2012-07-26

Applicant: Masami Suzuki ,  Norio Nishi ,  Junichi Matsumoto ,  Nobutaka Yoneyama ,  Satoshi Tokuoka ,  Etsushi Kato

Inventor： Masami Suzuki ,  Norio Nishi ,  Junichi Matsumoto ,  Nobutaka Yoneyama ,  Satoshi Tokuoka ,  Etsushi Kato

IPC: B23K26/02 ,  B23K26/04 ,  B23K26/067 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08

CPC classification number: B23K26/04 ,  B23K26/032 ,  B23K26/042 ,  B23K26/0643 ,  B23K26/0665 ,  B23K26/067 ,  B23K26/082 ,  B23K26/0853

Abstract: A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.

Abstract translation: 加工机器包括反射镜并将从激光振荡器振荡的光束L反射到其上布置工件的预定表面，光轴操作机构，并且通过改变方向将光束L的光轴定位在期望的目标照射位置 以及用于拍摄目标照射位置的图像及其反射镜中的周边的图像的摄像机传感器，以及用于检测指示到光轴操作机构的目标照射位置与实际位置之间的误差的误差校准机构 通过参照由照相机传感器拍摄的图像，在预定表面中的光束L的光轴。 对光轴操作机构的校正量，并且基于在处理期间用光束L照射目标照射位置的误差来确定。

公开(公告)号：US09343597B2

公开(公告)日：2016-05-17

申请号：US13566401

申请日：2012-08-03

Applicant: Masami Suzuki ,  Yoshihito Higashitsutsumi

Inventor： Masami Suzuki ,  Yoshihito Higashitsutsumi

IPC: H04N5/225 ,  H01L31/0232 ,  H04N5/369 ,  H01L27/146

CPC classification number: H01L23/552 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/02325 ,  H01L2224/13 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/369

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate.The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential.The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract translation: 图像拾取装置包括光学装置，透明导电膜，电极焊盘和穿透电极。 在光学装置中，在基板的第一面侧形成有用于接收光的光学元件区域，并且在与基板的第一表面相对的第二表面的一侧上形成外部连接端子。 透明导电膜形成为面向基板的第一表面。 电极焊盘形成在基板的第一表面上并且被配置为执行与固定电位的连接。 穿透电极连接到电极焊盘并形成为在第一表面和第二表面之间穿透衬底。 透明导电膜连接到电极焊盘，并且穿透电极连接到衬底的第二表面侧的外部连接端子。

公开(公告)号：US09153611B2

公开(公告)日：2015-10-06

申请号：US13814699

申请日：2011-08-11

Applicant: Yoshihito Higashitsutsumi ,  Satoshi Shimizu ,  Isaya Kitamura ,  Masami Suzuki

Inventor： Yoshihito Higashitsutsumi ,  Satoshi Shimizu ,  Isaya Kitamura ,  Masami Suzuki

IPC: H01L27/00 ,  H04N3/14 ,  H01L27/146 ,  G02B5/20 ,  H04N1/00 ,  H04N5/225 ,  H04N9/04 ,  H04N9/07

CPC classification number: H01L27/14601 ,  G02B5/201 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N1/00307 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N9/04 ,  H04N9/07 ,  H01L2924/00

Abstract: An optical sensor is described herein. By way of example, the optical sensor comprises a first light filter on a first light-receiving surface of an image sensor, and a second light filter on a second light-receiving surface of the image sensor. The second light-receiving surface is on an opposite side of the image sensor from the first light-receiving surface. The characteristics of the first light filter are different than characteristics of the second light filter.

Abstract translation: 本文描述了光学传感器。 作为示例，光学传感器包括在图像传感器的第一光接收表面上的第一滤光器和在图像传感器的第二光接收表面上的第二滤光器。 第二光接收表面在图像传感器的与第一光接收表面相反的一侧。 第一滤光器的特性与第二滤光器的特性不同。

公开(公告)号：US20140249667A1

公开(公告)日：2014-09-04

申请号：US14234244

申请日：2012-07-04

Applicant: Masami Suzuki

Inventor： Masami Suzuki

IPC: G05B19/418 ,  H01L21/677

CPC classification number: G05B19/41895 ,  G05B2219/31013 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67736 ,  Y02P90/20 ,  Y02P90/285 ,  Y02P90/60

Abstract: A processing facility includes transport management means for managing a transport vehicle which transports a processing target object by traveling along a transporting route which extends along a plurality of processing devices and a storage device for storing the processing target objects. The transport managing means: monitors process advancement information which is transmitted from the processing device to the primary managing means; selects, as advance transport origin and before the transport command information is transmitted from the primary managing means, a processing device, among the plurality of processing devices, in which a process performed on the processing target object has been completed, or is nearly completed; and performs advance transport control in which the transport vehicle is caused to travel to the processing device selected as the advance transport origin in order to carry out the processing target object from the processing device.

Abstract translation: 一种处理设备包括：运输管理装置，用于管理沿着沿着多个处理装置延伸的运送路线行进运送处理对象物体的运送车辆和用于存储处理对象物体的存储装置。 传输管理装置：监视从处理装置发送到主管理装置的进程提前信息; 选择作为提前传送原点，并且在从主要管理装置发送传输命令信息之前，在对处理目标对象执行的处理已经完成或接近完成的多个处理装置中的处理装置; 并且执行使运输车辆行进到选择为先进运输原点的处理装置的前进运输控制，以便从处理装置执行处理对象物体。

公开(公告)号：US08798838B2

公开(公告)日：2014-08-05

申请号：US13980843

申请日：2012-01-27

Applicant: Fumihiro Yamanaka ,  Masami Suzuki

Inventor： Fumihiro Yamanaka ,  Masami Suzuki

IPC: B60W20/00

CPC classification number: B60W20/40 ,  B60K6/48 ,  B60K6/547 ,  B60L11/14 ,  B60L15/2054 ,  B60W10/02 ,  B60W10/06 ,  B60W10/08 ,  B60W10/10 ,  B60W10/11 ,  B60W10/115 ,  B60W20/00 ,  B60W20/30 ,  B60W30/19 ,  B60W30/192 ,  B60W2600/00 ,  B60W2710/0644 ,  B60W2710/083 ,  B60W2710/1011 ,  Y02T10/6221 ,  Y02T10/6286 ,  Y02T10/645 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/72 ,  Y02T10/7275 ,  Y10S903/93

Abstract: A control device of a hybrid vehicle includes an engine, a motor/generator, a first clutch, an automatic transmission, a second clutch, and startup/shifting simultaneous processing section. When engine speed increase control for increasing the engine speed by the motor/generator in order to start up the engine during travel and downshifting control of the automatic transmission are processed in parallel, the startup/shifting simultaneous processing section uses the motor torque of the motor/generator to increase the increase of input speed by the downshifting control to a target input speed while engine speed increase control is being performed by the motor/generator.

Abstract translation: 混合动力车辆的控制装置包括发动机，电动机/发电机，第一离合器，自动变速器，第二离合器和起动/换档同时处理部。 当发动机转速增加时，由马达/发电机提高发动机转速，以便在行驶期间启动发动机并且自动变速器的降档控制被并行处理，起动/换档同时处理部分使用电动机的电动机转矩 /发电机，通过电动机/发电机执行发动机转速增加控制，通过降档控制将输入速度增加到目标输入速度。

公开(公告)号：US20140175896A1

公开(公告)日：2014-06-26

申请号：US14124357

申请日：2011-06-07

Applicant: Masami Suzuki

Inventor： Masami Suzuki

IPC: H03H7/40 ,  H02J5/00

CPC classification number: H03H7/40 ,  B60L11/182 ,  B60L11/1837 ,  H02J5/005 ,  H02J7/025 ,  H02J50/12 ,  H02J50/80 ,  H02J50/90

Abstract: In an impedance matching device between a power transmission circuit and a power transmission antenna, a storage unit stores tables associated with a load value, each storing control values of a coupling coefficient between the power transmission and reception antennae. A selection unit selects a table corresponding to the load value estimated by the load value estimation unit. An adjustment direction determination unit determines the direction of a position for reading out one of the control values from the selected table. A readout position determination unit determines the position for reading out the control value from the selected table based on the direction and a predetermined step width for shifting the position for reading out the control value. A circuit selection unit electrically connects a matching circuit or the through circuit. A control value output unit outputs the control value at the determined position to the selected circuit.

Abstract translation: 在电力传输电路和电力传输天线之间的阻抗匹配装置中，存储单元存储与负载值相关联的表，每个存储在发送和接收天线之间的耦合系数的控制值。 选择单元选择与由负载值估计单元估计的负载值对应的表。 调整方向确定单元从所选择的表中确定用于读出一个控制值的位置的方向。 读取位置确定单元基于用于移位用于读出控制值的位置的方向和预定步长确定用于从所选表读出控制值的位置。 电路选择单元电连接匹配电路或贯通电路。 控制值输出单元将所确定的位置处的控制值输出到所选择的电路。

公开(公告)号：US20140029270A1

公开(公告)日：2014-01-30

申请号：US13816213

申请日：2012-07-26

Applicant: Masami Suzuki ,  Satoshi Tokuoka ,  Satoru Maeda

Inventor： Masami Suzuki ,  Satoshi Tokuoka ,  Satoru Maeda

IPC: F21V8/00 ,  B29D11/00

CPC classification number: G02B6/0043 ,  B21K5/20 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/352 ,  B23K26/389 ,  B23K2103/50 ,  B29D11/00673 ,  G02B6/0061 ,  G02B6/0065 ,  Y10T428/24273

Abstract: A processing machine is configured to include a processing device capable of applying processing for forming many holes to a processing area as a part of a region to be processed in a workpiece, a transferring device to relatively move the workpiece with respect to the processing device after the processing is applied to a certain area in the region to be processed, and to position an unprocessed area as a new area to be processed by the processing device, a processing pattern storage unit to store information defining arrangement positions of the holes formed by the processing device, and a control unit to determine a target processing position of each of the holes by adding a position correction amount of each hole on a random basis to the position of each hole defined by the information stored in the processing pattern storage unit.

Abstract translation: 一种加工机构，其特征在于，包括能够对作为工件的待处理区域的一部分的处理区域进行多孔加工处理的处理装置，在所述处理装置之后相对于所述处理装置使所述工件相对移动的传送装置， 处理被应用于要处理的区域中的某个区域，并且将未处理区域定位为由处理装置处理的新区域;处理模式存储单元，用于存储定义由所述处理装置形成的孔的布置位置的信息 处理装置和控制单元，通过将每个孔的位置校正量随机地添加到由存储在处理模式存储单元中的信息定义的每个孔的位置来确定每个孔的目标处理位置。

公开(公告)号：US20130288248A1

公开(公告)日：2013-10-31

申请号：US13878181

申请日：2011-10-06

Applicant: Tatsumi Yamazaki ,  Hisafumi Okabe ,  Shinta Kobayashi ,  Yu Jau Chen ,  Atsuhiko Kato ,  Masami Suzuki ,  Koichi Matsubara

Inventor： Tatsumi Yamazaki ,  Hisafumi Okabe ,  Shinta Kobayashi ,  Yu Jau Chen ,  Atsuhiko Kato ,  Masami Suzuki ,  Koichi Matsubara

IPC: C12N5/095

CPC classification number: C12N5/0695 ,  G01N33/5011 ,  G01N33/5073

Abstract: The purpose of the present invention is to provide: a cancer stem cell mass from which cells incapable of forming cancer are substantially removed and which has a characteristic property of reproducing a layered structure of a cancer tissue; a process for producing the cancer stem cell mass; and use of the cancer stem cell mass. For achieving the purpose, the present inventors grew a human cancer tissue repeatedly in a NOG mouse, separated cancer cells from the grown cancer tissue, and made a comparison of various cancer cell culture processes with each other. As a result, a cancer stem cell composition which is homogeneous and is substantially free of the coexistence of cells capable of forming cancer and cells incapable of forming cancer in a mixed state can be produced successively by employing an attached culture process using a serum-free stem cell culture medium rather than a generally employed floating culture process, and consequently the present invention has been accomplished.

Abstract translation: 本发明的目的是提供：基本上除去不能形成癌症的细胞的癌干细胞群，其具有再现癌组织的层状结构的特征; 一种生产癌症干细胞团的方法; 并使用癌干细胞团。 为了达到上述目的，本发明人在NOG小鼠中反复生长人类癌组织，从生长的癌组织中分离癌细胞，并进行各种癌细胞培养方法的比较。 结果，可以通过使用不含血清的附着培养方法，连续地制备均质且基本上不含可形成癌细胞的细胞和不能混合形成癌症的细胞的癌干细胞组合物 干细胞培养基而不是通常使用的浮动培养方法，因此本发明已经实现。

公开(公告)号：US08513756B2

公开(公告)日：2013-08-20

申请号：US13186625

申请日：2011-07-20

Applicant: Masami Suzuki ,  Masayuki Nagao ,  Yasuyuki Ito

Inventor： Masami Suzuki ,  Masayuki Nagao ,  Yasuyuki Ito

IPC: H01L21/28

CPC classification number: H01L27/14618 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package includes: a supporting substrate; a functioning element and a first joining element formed on a first principal surface of the supporting substrate; a sealing substrate disposed in an opposing relationship to the supporting substrate with the functioning element and the first joining element interposed therebetween; a second joining element provided on a second principal surface of the supporting substrate; a through-electrode provided in and extending through the supporting substrate and adapted to electrically connect the first and second joining elements; and a first electromagnetic shield film coated in an overall area of a side face of the supporting substrate which extends perpendicularly to the first and second principal surfaces.

Abstract translation: 半导体封装包括：支撑衬底; 功能元件和形成在所述支撑基板的第一主表面上的第一接合元件; 密封基板，其与所述功能元件以及所述第一接合元件相对设置成与所述支撑基板相对的关系; 设置在所述支撑基板的第二主面上的第二接合元件; 设置在所述支撑基板中并贯穿所述支撑基板并且适于电连接所述第一和第二接合元件的通孔; 以及第一电磁屏蔽膜，其涂覆在所述支撑基板的与所述第一和第二主表面垂直延伸的侧面的整个区域中。