Invention Grant
- Patent Title: Polypeptides and their use
- Patent Title (中): 多肽及其用途
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Application No.: US14349634Application Date: 2012-10-24
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Publication No.: US09493513B2Publication Date: 2016-11-15
- Inventor: Sarikaya Mehmet , Yuhei Hayamizu , Christopher R. So , Candan Tamerler-Behar
- Applicant: UNIVERSITY OF WASHINGTON THROUGH ITS CENTER FOR COMMERCIALIZATION
- Applicant Address: US WA Seattle
- Assignee: University of Washington Through Its Center for Commercialization
- Current Assignee: University of Washington Through Its Center for Commercialization
- Current Assignee Address: US WA Seattle
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- International Application: PCT/US2012/061541 WO 20121024
- International Announcement: WO2013/063008 WO 20130502
- Main IPC: A61K38/00
- IPC: A61K38/00 ; C07K14/00 ; C07K7/08 ; C07K17/14

Abstract:
The present invention provides polypeptides that bind to inorganic solid surfaces, structures comprising such polypeptides, and methods of making such structures.
Public/Granted literature
- US20140249052A1 Polypeptides and their use Public/Granted day:2014-09-04
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