- 专利标题: Electronic component and method of manufacturing electronic component
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申请号: US14923999申请日: 2015-10-27
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公开(公告)号: US09496088B2公开(公告)日: 2016-11-15
- 发明人: Yukihiko Shirakawa , Tatsuo Inagaki , Shintaro Kon , Osamu Hirose , Masahiko Konno
- 申请人: TDK CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: TDK CORPORATION
- 当前专利权人: TDK CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP2011-129441 20110609
- 主分类号: H01G4/228
- IPC分类号: H01G4/228 ; H01G4/30 ; H01G4/12 ; H01G4/232 ; H01G4/012 ; H01G4/248 ; H05K1/18 ; H05K3/34
摘要:
An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.
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