Invention Grant
US09496119B1 E-beam inspection apparatus and method of using the same on various integrated circuit chips
有权
电子束检查装置及其在各种集成电路芯片上的使用方法
- Patent Title: E-beam inspection apparatus and method of using the same on various integrated circuit chips
- Patent Title (中): 电子束检查装置及其在各种集成电路芯片上的使用方法
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Application No.: US14989743Application Date: 2016-01-06
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Publication No.: US09496119B1Publication Date: 2016-11-15
- Inventor: Indranil De , Marian Mankos , Christopher Hess , Dennis J. Ciplickas
- Applicant: PDF Solutions, Inc.
- Applicant Address: US CA San Jose
- Assignee: PDF Solutions, Inc.
- Current Assignee: PDF Solutions, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01J37/22 ; H01J37/285 ; H01J37/147

Abstract:
The present invention discloses an e-beam inspection tool, and an apparatus for detecting defects. In one aspect is described an apparatus for detecting defects that includes a dual-deflection system that moves the e-beam over the integrated circuit to each of the plurality of predetermined locations, the dual deflection system including a magnetic deflection component that provides by magnetic deflection for movement of the e-beam through a plurality of areas on the integrated circuit and an electrostatic deflection component that provides by electrostatic deflection for movement of the e-beam within each of the plurality of areas.
Information query
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