Invention Grant
- Patent Title: Semiconductor device, semiconductor package, and electronic device
- Patent Title (中): 半导体器件，半导体封装和电子器件
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Application No.: US14254969Application Date: 2014-04-17
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Publication No.: US09496226B2Publication Date: 2016-11-15
- Inventor: Yong-Hoon Kim , In-Ho Choi , Keung-Beum Kim
- Applicant: SAMSUNG Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2011-0051631 20110530
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/522 ; H01L25/065 ; H01L25/10 ; H01L21/78 ; H01L21/48
Abstract:
A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.
Public/Granted literature
- US20140225236A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE Public/Granted day:2014-08-14
Information query
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