公开(公告)号：US09496226B2

公开(公告)日：2016-11-15

申请号：US14254969

申请日：2014-04-17

Applicant: SAMSUNG Electronics Co., Ltd.

Inventor： Yong-Hoon Kim ,  In-Ho Choi ,  Keung-Beum Kim

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065 ,  H01L25/10 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/4814 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/5225 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

Abstract translation: 提供半导体器件，半导体封装和电子器件。 电子设备包括设置在电路基板上的第一半导体封装。 第二半导体封装设置在电路基板上并与第一半导体封装间隔开。 绝缘电磁屏蔽结构设置在第一半导体封装的顶表面和侧表面上。 导电电磁屏蔽结构设置在电路基板上以覆盖第一和第二半导体封装和绝缘电磁屏蔽结构。