发明授权
- 专利标题: Structure and formation method of FinFET device
- 专利标题(中): FinFET器件的结构和形成方法
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申请号: US14621814申请日: 2015-02-13
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公开(公告)号: US09496264B2公开(公告)日: 2016-11-15
- 发明人: Kai-Hsuan Lee , Cheng-Yu Yang , Hsiang-Ku Shen , Han-Ting Tsai , Yimin Huang
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L27/092 ; H01L29/78 ; H01L21/335 ; H01L29/207 ; H01L29/36 ; H01L29/66 ; H01L21/8234 ; H01L21/266 ; H01L29/161 ; H01L29/49
摘要:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a first gate stack and a second gate stack over the semiconductor substrate. The semiconductor device structure also includes a first doped structure over the semiconductor substrate and adjacent to the first gate stack. The first doped structure includes a III-V compound semiconductor material and a dopant. The semiconductor device structure further includes a second doped structure over the semiconductor substrate and adjacent to the second gate stack. The second doped structure includes the III-V compound semiconductor material and the dopant. One of the first doped structure and the second doped structure is an n-type semiconductor structure, and the other one of the first doped structure and the second doped structure is a p-type semiconductor structure.
公开/授权文献
- US20160240536A1 STRUCTURE AND FORMATION METHOD OF FINFET DEVICE 公开/授权日:2016-08-18
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