Invention Grant
- Patent Title: Laser submounts formed using etching process
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Application No.: US14862967Application Date: 2015-09-23
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Publication No.: US09502857B2Publication Date: 2016-11-22
- Inventor: Roger L. Hipwell, Jr. , Dadi Setiadi
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01L21/78 ; H01L21/683 ; H01S5/02 ; G11B5/105 ; G11B5/31 ; G11B5/00
Abstract:
A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.
Public/Granted literature
- US20160013615A1 LASER SUBMOUNTS FORMED USING ETCHING PROCESS Public/Granted day:2016-01-14
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