Invention Grant
- Patent Title: Modular camera array
- Patent Title (中): 模块化摄像机阵列
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Application No.: US14140929Application Date: 2013-12-26
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Publication No.: US09503709B2Publication Date: 2016-11-22
- Inventor: Jianbo Shi , Daniel C. Middleton
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H04N13/02
- IPC: H04N13/02

Abstract:
Devices, systems and methods employing modular camera arrays are described. A two-dimensional array of cameras may be arranged in a non-rectangular array. A first camera, a second camera, and a third camera in the array may be located approximately equidistant from each other, and/or may be arranged approximately in an equilateral triangle, an isosceles triangle, a scalene triangle, and/or a right triangle.
Public/Granted literature
- US20140232831A1 MODULAR CAMERA ARRAY Public/Granted day:2014-08-21
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