Invention Grant
- Patent Title: Printed circuit board for semiconductor package
- Patent Title (中): 印刷电路板用于半导体封装
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Application No.: US14748970Application Date: 2015-06-24
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Publication No.: US09504152B2Publication Date: 2016-11-22
- Inventor: Hai Liu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201410312409 20140702; KR10-2015-0029106 20150302
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L23/498 ; H05K3/46 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L25/10
Abstract:
A printed circuit board for a semiconductor package including a printed circuit board body, a plurality of ball lands on one surface of the printed circuit board body, a first plating layer on a portion of each of the ball lands, and a second plating layer on another portion of each of the ball lands may be provided. An upper surface of the first plating layer may be coplanar with an upper surface of the second plating layer.
Public/Granted literature
- US20160005683A1 PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE Public/Granted day:2016-01-07
Information query
