公开(公告)号：US09504152B2

公开(公告)日：2016-11-22

申请号：US14748970

申请日：2015-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hai Liu

IPC: H05K1/11 ,  H01L23/498 ,  H05K3/46 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15323 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/244 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A printed circuit board for a semiconductor package including a printed circuit board body, a plurality of ball lands on one surface of the printed circuit board body, a first plating layer on a portion of each of the ball lands, and a second plating layer on another portion of each of the ball lands may be provided. An upper surface of the first plating layer may be coplanar with an upper surface of the second plating layer.

Abstract translation: 一种用于半导体封装的印刷电路板，包括印刷电路板主体，印刷电路板主体的一个表面上的多个球形区域，每个球场的一部分上的第一镀层和第二镀层 可以设置每个球场的另一部分。 第一镀层的上表面可以与第二镀层的上表面共面。

公开(公告)号：US10049970B2

公开(公告)日：2018-08-14

申请号：US15183868

申请日：2016-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hai Liu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H05K1/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10

Abstract: A method of manufacturing a semiconductor package according to the present inventive concepts comprises preparing a printed circuit board (PCB) including a protected layer, exposing a portion of the protected layer from the insulating layer, forming a solder ball land by processing the exposed surface of the protected layer, forming a solder ball on the solder ball land, and mounting a semiconductor chip on the solder ball formed on the PCB. The solder balls include copper of about 0.01 wt % to about 0.5 wt %.