Invention Grant
US09504169B2 Printed circuit board having embedded electronic device and method of manufacturing the same 有权
具有嵌入式电子装置的印刷电路板及其制造方法

Printed circuit board having embedded electronic device and method of manufacturing the same
Abstract:
Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
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