Invention Grant
- Patent Title: Printed circuit board having embedded electronic device and method of manufacturing the same
- Patent Title (中): 具有嵌入式电子装置的印刷电路板及其制造方法
-
Application No.: US14060365Application Date: 2013-10-22
-
Publication No.: US09504169B2Publication Date: 2016-11-22
- Inventor: Young Nam Hwang , Ju Wan Nam , Seung Wan Woo , Yee Na Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2013-0083156 20130715
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/00 ; H05K3/46

Abstract:
Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
Public/Granted literature
- US20150014034A1 PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-01-15
Information query