Invention Grant
- Patent Title: Ejectable component assemblies in electronic devices
- Patent Title (中): 电子设备中的可弹性组件
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Application No.: US14276610Application Date: 2014-05-13
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Publication No.: US09504179B2Publication Date: 2016-11-22
- Inventor: Erik L. Wang , Robert Sean Murphy , Tang Yew Tan , Jeffrey Eugene Neaves , Lawrence E. Davis , Sung Kim
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K5/02 ; H05K1/02 ; H04M1/02

Abstract:
Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.
Public/Granted literature
- US20140247567A1 EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2014-09-04
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