公开(公告)号：US10277722B2

公开(公告)日：2019-04-30

申请号：US15275161

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung Kim

IPC: H04M1/00 ,  H04B1/38 ,  H04M1/02 ,  H05K5/02 ,  H05K1/02 ,  H05K7/14

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

公开(公告)号：US20170013098A1

公开(公告)日：2017-01-12

申请号：US15275161

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung Kim

IPC: H04M1/02 ,  H05K7/14 ,  H05K5/02

CPC classification number: H04M1/026 ,  H04M2250/14 ,  H05K1/02 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1427

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

Abstract translation: 电子设备设置有可排出的部件组件，其可以与设备的壳体的外表面基本齐平，尽管其制造方面有变化。 可喷射部件组件可以包括连接到设备的电路板的连接器，以及可以装载有通过设备壳体中的开口插入的可移除模块的托盘，并且用于将可拆卸模块与电路板功能对准。 可喷射部件组件还可以包括联接到装置的壳体的喷射器，用于从连接器弹出托盘，并且因此从装置本身排出托盘。

公开(公告)号：US20140247567A1

公开(公告)日：2014-09-04

申请号：US14276610

申请日：2014-05-13

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung Kim

IPC: H05K7/14 ,  H05K1/02

CPC classification number: H04M1/026 ,  H04M2250/14 ,  H05K1/02 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1427

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

Abstract translation: 电子设备设置有可排出的部件组件，其可以与设备的壳体的外表面基本齐平，尽管其制造方面有变化。 可喷射部件组件可以包括连接到设备的电路板的连接器，以及可以装载有通过设备壳体中的开口插入的可移除模块的托盘，并且用于将可拆卸模块与电路板功能对准。 可喷射部件组件还可以包括联接到装置的壳体的喷射器，用于从连接器弹出托盘，并且因此从装置本身排出托盘。

公开(公告)号：US11050865B2

公开(公告)日：2021-06-29

申请号：US16374611

申请日：2019-04-03

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung H. Kim

IPC: H01R12/70 ,  H04M1/00 ,  H04B1/3818 ,  G06K13/08 ,  H05K7/14 ,  H04M1/02 ,  H05K5/02 ,  H05K1/02

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

公开(公告)号：US20190230202A1

公开(公告)日：2019-07-25

申请号：US16374611

申请日：2019-04-03

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung H. Kim

IPC: H04M1/02 ,  H05K7/14 ,  H05K1/02 ,  H05K5/02

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

公开(公告)号：US09504179B2

公开(公告)日：2016-11-22

申请号：US14276610

申请日：2014-05-13

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung Kim

IPC: H05K7/14 ,  H05K5/02 ,  H05K1/02 ,  H04M1/02

CPC classification number: H04M1/026 ,  H04M2250/14 ,  H05K1/02 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1427

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

Abstract translation: 电子设备设置有可排出的部件组件，其可以与设备的壳体的外表面基本齐平，尽管其制造方面有变化。 可喷射部件组件可以包括连接到设备的电路板的连接器，以及可以装载有通过设备壳体中的开口插入的可移除模块的托盘，并且用于将可拆卸模块与电路板功能对准。 可喷射部件组件还可以包括联接到装置的壳体的喷射器，用于从连接器弹出托盘，并且因此从装置本身排出托盘。