Invention Grant
- Patent Title: Spring probe
- Patent Title (中): 弹簧探头
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Application No.: US14605798Application Date: 2015-01-26
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Publication No.: US09506949B2Publication Date: 2016-11-29
- Inventor: Yi-Lung Lee , Horng-Kuang Fan
- Applicant: MPI CORPORATION
- Applicant Address: TW Chu-Pei, Hsinchu Shien
- Assignee: MPI CORPORATION
- Current Assignee: MPI CORPORATION
- Current Assignee Address: TW Chu-Pei, Hsinchu Shien
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G01R1/067
- IPC: G01R1/067

Abstract:
A spring probe includes a spring sleeve and a needle having a body located inside the spring sleeve and a head protruded out of a lower non-spring section of the spring sleeve and having a stopping block. The lower non-spring section is abutted against and fixed to the stopping block, facilitating assembly of the spring probe. A method for manufacturing the spring probe is disclosed including the steps of forming a spring sleeve having a lower non-spring section with a slot and a guiding sheet adjacent to the slot by photolithography technique, manufacturing a needle having a stopping block with a bonding pad and an engagement rib by MEMS manufacturing process, sleeving the spring sleeve onto the needle to engage the engagement rib into the slot, and fixing the guiding sheet and the needle together by reflow soldering the bonding pad.
Public/Granted literature
- US20150247882A1 SPRING PROBE Public/Granted day:2015-09-03
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