Invention Grant
- Patent Title: Singulation apparatus and method
- Patent Title (中): 分割装置和方法
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Application No.: US14058396Application Date: 2013-10-21
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Publication No.: US09508570B2Publication Date: 2016-11-29
- Inventor: Chi Wah Cheng , Eric Lap Kei Chow , Joseph Hoi Shuen Tang , Chun Kit Liu
- Applicant: Chi Wah Cheng , Eric Lap Kei Chow , Joseph Hoi Shuen Tang , Chun Kit Liu
- Applicant Address: SG Singapore
- Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
- Current Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B28D5/02 ; H01L21/687

Abstract:
A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device with members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device with members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being configured and arranged for cutting the workpiece.
Public/Granted literature
- US20150111366A1 SINGULATION APPARATUS AND METHOD Public/Granted day:2015-04-23
Information query
IPC分类: