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US09508602B2 Temperature-controlled implanting of a diffusion-suppressing dopant in a semiconductor structure 有权
温度控制在半导体结构中注入扩散抑制掺杂剂

Temperature-controlled implanting of a diffusion-suppressing dopant in a semiconductor structure
Abstract:
Semiconductor structures and methods of fabrication are provided for, for instance, inhibiting diffusion of active dopant within a semiconductor material. A diffusion-suppressing dopant is implanted via, an implanting process under controlled temperature, into a semiconductor material of a semiconductor structure to define a diffusion-suppressed region within the semiconductor material. One or more active regions are established within the diffusion-suppressed region of the semiconductor structure by, for example, implanting an active dopant into the semiconductor material. The implanting of the diffusion-suppressing dopant facilitates inhibiting diffusion of the active dopant within the diffusion-suppressed region.
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