Invention Grant
- Patent Title: Temperature-controlled implanting of a diffusion-suppressing dopant in a semiconductor structure
- Patent Title (中): 温度控制在半导体结构中注入扩散抑制掺杂剂
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Application No.: US14593183Application Date: 2015-01-09
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Publication No.: US09508602B2Publication Date: 2016-11-29
- Inventor: Mitsuhiro Togo
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley and Mesiti PC
- Agent Nicholas Mesiti
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/8238 ; H01L21/265 ; H01L29/66 ; H01L29/32 ; H01L29/10 ; H01L29/08 ; H01L27/092 ; H01L29/167

Abstract:
Semiconductor structures and methods of fabrication are provided for, for instance, inhibiting diffusion of active dopant within a semiconductor material. A diffusion-suppressing dopant is implanted via, an implanting process under controlled temperature, into a semiconductor material of a semiconductor structure to define a diffusion-suppressed region within the semiconductor material. One or more active regions are established within the diffusion-suppressed region of the semiconductor structure by, for example, implanting an active dopant into the semiconductor material. The implanting of the diffusion-suppressing dopant facilitates inhibiting diffusion of the active dopant within the diffusion-suppressed region.
Public/Granted literature
- US20160204039A1 TEMPERATURE-CONTROLLED IMPLANTING OF A DIFFUSION-SUPPRESSING DOPANT IN A SEMICONDUCTOR STRUCTURE Public/Granted day:2016-07-14
Information query
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