Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US15202749Application Date: 2016-07-06
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Publication No.: US09508669B2Publication Date: 2016-11-29
- Inventor: Yasunari Umemoto , Daisuke Tokuda , Tsunekazu Saimei , Hiroaki Tokuya
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-Fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-Fu
- Agency: Studebaker & Brackett PC
- Priority: JP2014-003197 20140110
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L23/00 ; H01L29/66 ; H01L29/08

Abstract:
A semiconductor device that includes a bipolar transistor, wherein a third opening, through which a pillar bump and a second wiring line, which is electrically connected to an emitter layer, contact each other, is shifted in a longitudinal direction of the emitter layer away from a position at which the third opening would be directly above the emitter layer. The third opening is arranged, with respect to the emitter layer, such that an end portion of the emitter layer in the longitudinal direction of the emitter layer and the edge of the opening of the third opening are substantially aligned with each other.
Public/Granted literature
- US20160315060A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-10-27
Information query
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