Invention Grant
- Patent Title: Stacked semiconductor chip RGBZ sensor
- Patent Title (中): 堆叠半导体芯片RGBZ传感器
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Application No.: US14579882Application Date: 2014-12-22
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Publication No.: US09508681B2Publication Date: 2016-11-29
- Inventor: Chung Chun Wan
- Applicant: Google Inc.
- Applicant Address: US CA Mountain View
- Assignee: GOOGLE INC.
- Current Assignee: GOOGLE INC.
- Current Assignee Address: US CA Mountain View
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: G01J5/20
- IPC: G01J5/20 ; H01L25/04 ; H01L27/146 ; H04N5/33 ; H04N5/3745 ; H04N5/378

Abstract:
An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.
Public/Granted literature
- US20160181226A1 STACKED SEMICONDUCTOR CHIP RGBZ SENSOR Public/Granted day:2016-06-23
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