Invention Grant
- Patent Title: 3D device packaging using through-substrate pillars
- Patent Title (中): 3D设备封装采用贯穿基板支柱
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Application No.: US14039622Application Date: 2013-09-27
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Publication No.: US09508701B2Publication Date: 2016-11-29
- Inventor: Douglas M. Reber , Mehul D. Shroff , Edward O. Travis
- Applicant: Freescale Semiconductor, Inc.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L25/00 ; H01L23/31 ; H01L25/065 ; H01L21/304 ; H01L23/00 ; H01L21/768
Abstract:
A method for 3D device packaging utilizes through-substrate pillars to mechanically and electrically bond two or more dice. The first die includes a set of access holes extending from a surface of the first die to a set of pads at a metal layer of the first die. The second die includes a set of metal pillars. The first die and the second die are stacked such that each metal pillar extends from a surface of the second die to a corresponding pad via a corresponding access hole. The first die and second die are mechanically and electrically bonded via solder joints formed between the metal pillars and the corresponding pads.
Public/Granted literature
- US20150091178A1 3D DEVICE PACKAGING USING THROUGH-SUBSTRATE PILLARS Public/Granted day:2015-04-02
Information query
IPC分类:
