Invention Grant
US09508841B2 Method and system for a semiconductor device with integrated transient voltage suppression
有权
具有集成瞬态电压抑制的半导体器件的方法和系统
- Patent Title: Method and system for a semiconductor device with integrated transient voltage suppression
- Patent Title (中): 具有集成瞬态电压抑制的半导体器件的方法和系统
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Application No.: US13957115Application Date: 2013-08-01
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Publication No.: US09508841B2Publication Date: 2016-11-29
- Inventor: Avinash Srikrishnan Kashyap , Peter Micah Sandvik , James Jay McMahon , Ljubisa Dragoljub Stevanovic
- Applicant: General Electric Company
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent John P. Darling
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L29/74 ; H01L27/02 ; H01L29/861 ; H01L29/739

Abstract:
A power transistor assembly and method of operating the assembly are provided. The power transistor assembly includes integrated transient voltage suppression on a single semiconductor substrate and includes a transistor formed of a wide band gap material, the transistor including a gate terminal, a source terminal, and a drain terminal, the transistor further including a predetermined maximum allowable gate voltage value, and a transient voltage suppression (TVS) device formed of a wide band gap material, the TVS device formed with the transistor as a single semiconductor device, the TVS device electrically coupled to the transistor between at least one of the gate and source terminals and the drain and source terminals, the TVS device including a breakdown voltage limitation selected to be greater than the predetermined maximum allowable gate voltage value.
Public/Granted literature
- US20150034969A1 METHOD AND SYSTEM FOR A SEMICONDUCTOR DEVICE WITH INTEGRATED TRANSIENT VOLTAGE SUPPRESSION Public/Granted day:2015-02-05
Information query
IPC分类: