Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14602660Application Date: 2015-01-22
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Publication No.: US09515186B2Publication Date: 2016-12-06
- Inventor: Ha-Jin Lim , Hyeong-Joon Kim , Nae-In Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2014-0154660 20141107
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L21/8238 ; H01L29/66 ; H01L27/092

Abstract:
A semiconductor device includes a semiconductor substrate including a group III element and a group V element, and a gate structure on the semiconductor substrate. The semiconductor substrate includes a first region which contacts a bottom surface of the gate 5 structure and a second region which is disposed under the first region. The concentration of the group III element in the first region is lower than that of the group V element in the first region, and the concentration of the group III element in the second region is substantially equal to that of the group V element in the second region.
Public/Granted literature
- US20150206974A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-07-23
Information query
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