Invention Grant
- Patent Title: Ethylene propylene-diene interpolymer composition
- Patent Title (中): 乙烯丙烯 - 二烯互聚物组合物
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Application No.: US14364999Application Date: 2012-11-30
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Publication No.: US09518137B2Publication Date: 2016-12-13
- Inventor: Brian W. Walther , Susan M. Song , Paul J. Caronia , Lin Fu
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Husch Blackwell LLP
- International Application: PCT/US2012/067257 WO 20121130
- International Announcement: WO2013/090024 WO 20130620
- Main IPC: C08F210/18
- IPC: C08F210/18 ; C08K3/00 ; C08L23/08 ; C08F210/02 ; C08F4/64 ; C08F210/06 ; C08F236/20
Abstract:
The present disclosure is directed to a composition and articles containing the composition. The composition includes an ethylene-propylene-diene interpolymer (EPDM) having a rheology ratio greater than 33. The EPDM also has a molecular weight distribution greater than 3.0. The composition has a dissipation factor less than or equal to 0.01 radians as measured in accordance with ASTM D 150 (130° C., 60 Hz).
Public/Granted literature
- US20140343213A1 Ethylene-Propylene-Diene Interpolymer Composition Public/Granted day:2014-11-20
Information query
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