Invention Grant
- Patent Title: Processing systems and apparatus adapted to process substrates in electronic device manufacturing
- Patent Title (中): 适用于在电子设备制造中处理基板的处理系统和装置
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Application No.: US14202763Application Date: 2014-03-10
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Publication No.: US09524889B2Publication Date: 2016-12-20
- Inventor: Steve S. Hongkham , Paul B. Reuter , Eric A. Englhardt , Ganesh Balasubramanian , Xinglong Chen , JuanCarlos Rocha-Alvarez
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: B01J19/00
- IPC: B01J19/00 ; H01L21/67
Abstract:
A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects.
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