Invention Grant
- Patent Title: Method for fabricating package structure
- Patent Title (中): 制造包装结构的方法
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Application No.: US15143691Application Date: 2016-05-02
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Publication No.: US09524944B2Publication Date: 2016-12-20
- Inventor: Chun-Wei Yeh , Chun-Hsien Shen , Hsiu-Jung Li , Ya-Yi Lai , Fu-Tang Huang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW102115571A 20130501
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/4763 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L23/31 ; H01L23/525
Abstract:
A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.
Public/Granted literature
- US20160247773A1 METHOD FOR FABRICATING PACKAGE STRUCTURE Public/Granted day:2016-08-25
Information query
IPC分类:
