-
公开(公告)号：US20140327131A1
公开(公告)日：2014-11-06
申请号：US13971237
申请日：2013-08-20
发明人： Chun-Wei Yeh , Chun-Hsien Shen , Hsiu-Jung Li , Ya-Yi Lai , Fu-Tang Huang
IPC分类号： H01L23/00
CPC分类号： H01L24/05 , H01L23/3114 , H01L23/3192 , H01L23/525 , H01L23/562 , H01L24/03 , H01L24/13 , H01L2224/02351 , H01L2224/02375 , H01L2224/0345 , H01L2224/03462 , H01L2224/0391 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05027 , H01L2224/05569 , H01L2224/05572 , H01L2224/1134 , H01L2224/11849 , H01L2224/13006 , H01L2224/13026 , H01L2224/131 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
摘要： A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.
摘要翻译： 公开了一种封装结构，其包括具有主体的基板，形成在主体上的多个导电焊盘和形成在主体上的表面钝化层，并且具有用于暴露导电焊盘的多个开口; 形成在所述表面钝化层的开口中并电连接到所述导电焊盘的多个导电通孔; 形成在所述表面钝化层上并电连接到所述导电通孔的多个电路，其中所述电路具有多个电触点; 至少形成在所述表面钝化层上并且与所述电路相交的图案部分; 以及形成在表面钝化层，电路和图案部分上并且具有多个开口的第二钝化层，用于暴露电路的电接触部分，从而加强电路和钝化层之间的接合。
-
公开(公告)号：US09524944B2
公开(公告)日：2016-12-20
申请号：US15143691
申请日：2016-05-02
发明人： Chun-Wei Yeh , Chun-Hsien Shen , Hsiu-Jung Li , Ya-Yi Lai , Fu-Tang Huang
IPC分类号： H01L21/44 , H01L21/4763 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L23/31 , H01L23/525
CPC分类号： H01L24/05 , H01L23/3114 , H01L23/3192 , H01L23/525 , H01L23/562 , H01L24/03 , H01L24/13 , H01L2224/02351 , H01L2224/02375 , H01L2224/0345 , H01L2224/03462 , H01L2224/0391 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05027 , H01L2224/05569 , H01L2224/05572 , H01L2224/1134 , H01L2224/11849 , H01L2224/13006 , H01L2224/13026 , H01L2224/131 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
摘要： A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.
摘要翻译： 公开了一种封装结构，其包括具有主体的基板，形成在主体上的多个导电焊盘和形成在主体上的表面钝化层，并且具有用于暴露导电焊盘的多个开口; 形成在所述表面钝化层的开口中并电连接到所述导电焊盘的多个导电通孔; 形成在所述表面钝化层上并电连接到所述导电通孔的多个电路，其中所述电路具有多个电触点; 至少形成在所述表面钝化层上并且与所述电路相交的图案部分; 以及形成在表面钝化层上的第二钝化层，电路和图案部分d具有多个开口，用于暴露电路的电接触部分，从而加强电路和钝化层之间的接合。
-
公开(公告)号：US20160247773A1
公开(公告)日：2016-08-25
申请号：US15143691
申请日：2016-05-02
发明人： Chun-Wei Yeh , Chun-Hsien Shen , Hsiu-Jung Li , Ya-Yi Lai , Fu-Tang Huang
IPC分类号： H01L23/00
CPC分类号： H01L24/05 , H01L23/3114 , H01L23/3192 , H01L23/525 , H01L23/562 , H01L24/03 , H01L24/13 , H01L2224/02351 , H01L2224/02375 , H01L2224/0345 , H01L2224/03462 , H01L2224/0391 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05027 , H01L2224/05569 , H01L2224/05572 , H01L2224/1134 , H01L2224/11849 , H01L2224/13006 , H01L2224/13026 , H01L2224/131 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
摘要： A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have, a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.
摘要翻译： 公开了一种封装结构，其包括具有主体的基板，形成在主体上的多个导电焊盘和形成在主体上的表面钝化层，并且具有用于暴露导电焊盘的多个开口; 形成在所述表面钝化层的开口中并电连接到所述导电焊盘的多个导电通孔; 形成在所述表面钝化层上并电连接到所述导电通路的多个电路，其中所述电路具有多个电触头; 至少形成在所述表面钝化层上并且与所述电路相交的图案部分; 以及形成在表面钝化层上的第二钝化层，电路和图案部分d具有多个开口，用于暴露电路的电接触部分，从而加强电路和钝化层之间的接合。
-
-
搜索结果
3 条记录 (耗时 0.015 秒)
