Invention Grant
- Patent Title: Component-embedded resin substrate
- Patent Title (中): 部件嵌入式树脂基板
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Application No.: US14246682Application Date: 2014-04-07
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Publication No.: US09526176B2Publication Date: 2016-12-20
- Inventor: Norio Sakai , Yoshihito Otsubo
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto-Fu
- Agency: Pearne & Gordon LLP
- Priority: JP2011-226960 20111014
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/498 ; H01L23/50 ; H01L23/00 ; H05K3/46 ; H05K1/02 ; H05K1/03

Abstract:
A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.
Public/Granted literature
- US20140218884A1 COMPONENT-EMBEDDED RESIN SUBSTRATE Public/Granted day:2014-08-07
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