Invention Grant
- Patent Title: Micro-electro mechanical apparatus with interdigitated spring
- Patent Title (中): 具有交错弹簧的微电机械设备
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Application No.: US14151843Application Date: 2014-01-10
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Publication No.: US09529012B2Publication Date: 2016-12-27
- Inventor: Shih-Chieh Lin , Chao-Ta Huang , Chung-Yuan Su , Yu-Wen Hsu
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW102107354A 20130301
- Main IPC: G01P15/08
- IPC: G01P15/08 ; G01P15/125

Abstract:
A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively.
Public/Granted literature
- US20140245832A1 MICRO-ELECTRO MECHANICAL APPARATUS WITH INTERDIGITATED SPRING Public/Granted day:2014-09-04
Information query
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